发明名称 |
Sn-Zn lead-free solder alloy and soldered bond |
摘要 |
An Sn-Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt % aluminum. Upon preservation of solder paste not only under refrigeration but also at a room temperature or higher, the inside of solder particle is protected by the protective magnesium/aluminum oxide film formed on the solder particle surface, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at the elevated temperature during soldering, the solder alloy enters a state where said protective oxide film is easily destroyed, so that good wettability is held.
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申请公布号 |
US7070736(B2) |
申请公布日期 |
2006.07.04 |
申请号 |
US20030468606 |
申请日期 |
2003.08.19 |
申请人 |
NIPPON METAL INDUSTRY, CO., LTD. |
发明人 |
YOSHIKAWA MASAAKI;AOYAMA HARUO;TANAKA HIROTAKA |
分类号 |
B23K35/26;B23K20/04;B23K35/02;B23K35/36;C22C13/00;H05K3/34 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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