STRUCTURE FOR FLIP-CHIP BONDING A LIGHT EMITTING DEVICE USING METAL COLUMN

摘要

A flip-chip bonding structure of a light-emitting element is provided. The structure improves a heat emission efficiency by using a metal column having a high thermal conductivity instead of a solder bump. The structure includes a light-emitting element, a sub-mount, and a metal column. The metal column connects the light-emitting element with the sub-mount electrically and thermally.