发明名称 |
Printhead and ink supply arrangement |
摘要 |
Microelectromechanical printheads are formed on a silicon wafer using etching technology similar that used in standard integrated circuit fabrication processes. The printheads include a very large number of micron-order ink inlet channels. A difficulty arises in accurately providing such a printhead with a reliable ink supply. The present invention addresses the above problem by providing an ink supply molding that includes a slot to receive the printhead. A plurality of ink supply passageways are formed in the ink supply molding of approximately 100 micron width. The ink supply molding is received into a baffle molding that includes ink conduits which in turn communicate with the ink supply passageway. In one embodiment a web of ink filtering material is disposed between the ink supply molding and the baffle molding.
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申请公布号 |
US7070258(B2) |
申请公布日期 |
2006.07.04 |
申请号 |
US20050026063 |
申请日期 |
2005.01.03 |
申请人 |
SILVERBROOK RESEARCH PTY LTD |
发明人 |
SILVERBROOK KIA |
分类号 |
B41J2/155;B41J2/04;B41J2/05;B41J2/14;B41J2/16;H01L21/302;H01L21/461 |
主分类号 |
B41J2/155 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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