| 摘要 |
The method finds application in metallurgy for making of bimetals. It reduces the brittleness of the bond at lower compounding temperatures and smaller thermal stresses in the compounding zone. The bond produced has good tensility strength. By the method an intermediate layer is fitted between the junction surfaces of the two objects to be joined - copper and austenitic steel, the junction surfaces, two objects and the intermediate layer are pressed together and thus the area formed is heated whilst the diffusion process is running. On the junction surface of steel object (2) or against its surface a first intermediate layer (3) and a second intermediate layer (4) are found on the junction surface of the copper object (1) or against its surface. At least a third intermediate layer (5) is found between layer (3) and object (1) made of silver (Ag), or of silver (Ag) and copper (Cu) either as an alloy or as a mixture. |
