| 摘要 |
A WIRE SAW HAS A SMALL DIAMETER METAL AND A LAYER OF ABRASIVE GRAINS FIRMLY AFFIXED TO THE WIRE SURFACE BY A BRAZER OR SOLDERED ACTIVE BOND. PREFERABLY, THE GRAINS ARE PRESENT IN A SINGLE LAYER. THE GRAINS ARE DISPOSED ON THE SURFACE OF THE WIRE IN A PRESELECTED SURFACE DISTRIBITION. THE WIRE SAW CAN BE MADE BY A COMPLETELY CONTINUOUS PROCESS INVOLVING COATING THE WIRE WITH A PASTE OF METAL BOND POWER COMPONENTS COMBINED WITH A FUGITIVE LIQUID BINDER COMPONENTS. ABRASIVE GRAINS ARE DEPOSITED INTO A LAYER OF THE PASTE. THEREAFTER, TE BOND COMPOSITION IS FUSED AT ELEVATED TEMPERATURE TO BRAZE THE GRAINS TO THE WIRE. THE ABRASIVE CAN INCLUDE SUPERABRASIVE METERIALS, SUCH AS DIAMOND AND CUBIC BORON NITRIDE. ACCORDINGLY, THE NOVEL WIRE SAW IS SUITABLE FOR CUTTING THIN WAFERS CERAMIC WAFERS WITH MINIMUM WASTE OF THE WORK PIECE.
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