| 摘要 |
A WAFER TO BE CHAMFERED IS SUPPORTED IN SUCH A MANNER AS TO ROTATE AND TO MOVE IN THE X-AXIS DIRECTION AND THE Y-AXIS DIRECTION WHICH ARE PERPENDICULAR TO ONE ANOTHER, AND A PERIPHERY GRINDING WHEEL (48) IS ROTATABLY PLACED ON THE Y-AXIS. TO CHAMFER A CIRCULAR PART (C) OF THE WAFER (W), THE CIRCULAR (C) PART OF THE WAFER (W) IS PRESSED AGAINST THE ROTATING PERIPHERY GRINDING WHEEL (48), AND THEN, THE WAFER IS ROTATED.TO CHAMFER AN ORIENTATION FLAT OF THE WAFER, THE ORIENTATION FLAT OF THE WAFER IS PRESSED AGAINST THE ROTATING PERIPHERY GRINDING WHEEL (48), AND THEN, THE WAFER (W) IS FED IN THE X-AXIS DIRECTION.(FIG. 2)
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