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发明名称
BUMP FOR SEMICONDUCTOR PACKAGE, FABRICATION METHOD THEREOF, AND SEMICONDUCTOR PACKAGE USING THE SAME
摘要
申请公布号
KR100597995(B1)
申请公布日期
2006.06.30
申请号
KR20050007764
申请日期
2005.01.27
申请人
NEPES CO., LTD.
发明人
PARK, YUN MOOK
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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