| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering apparatus capable of stably controlling and managing a low oxygen concentration in a reflow furnace by reducing the amount of an inert gas supplied into the reflow furnace for controlling and managing the oxygen concentration in the reflow furnace and reducing the oxygen concentration in the reflow furnace even if the amount of the supplied inert gas is small. SOLUTION: In this reflow soldering apparatus, while the inert gas is supplied into the reflow furnace having a transfer inlet at one end thereof and a transfer outlet at the other end thereof and having a plurality of heating units and cooling units between them to control the oxygen concentration in the reflow furnace, a printed wiring board on which electronic components are mounted via cream solder is transferred from the transfer inlet to the transfer outlet, and reflow is carried out by heating with the plurality of heating units to solder them. The passage for supplying the inert gas into the reflow furnace is disposed in a location wherein it is heated by the heating units, and thus the heated inert gas is supplied into the reflow furnace. COPYRIGHT: (C)2006,JPO&NCIPI |
