| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of heating and cooling a semiconductor wafer which can cool the semiconductor wafer efficiently in a short time in a heating and a cooling process in a semiconductor manufacturing process. SOLUTION: The method of heating and cooling the semiconductor wafer comprises a process (a) wherein, with a lower heating plate being closer to the semiconductor wafer than to a cooling plate, voltage is applied to at least the lower heating plate out of an upper heating plate and the lower heating plate, a process (b) wherein a state that voltage is applied to the upper heating plate is maintained or voltage is newly applied to the upper heating plate and then the application of voltage to the lower heating plate is stopped, a process (c) wherein the lower heating plate is so moved as to be closer to the cooling plate than to the semiconductor wafer, and a process (d) wherein the application of voltage to the upper heating plate is stopped and at the same time the semiconductor wafer is so moved as to be closer to the lower heating plate and the cooling plate. COPYRIGHT: (C)2006,JPO&NCIPI
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