| 摘要 |
An apparatus for removing an edge bead in, e.g., a plating process for fabricating a semiconductor device is provided, by which a wafer surface may be prevented from being oxidized by a chemical used in an edge bead removal (EBR) process. The apparatus may includes a spin chuck; a wafer on the spin chuck having a metal layer thereon; a nozzle for spraying a chemical on an edge of the wafer; and a cover shield having a bent (or curved) portion opposing a lateral side of the wafer. Accordingly, the bent or curved portion of the sidewall of the cover shield prevents or reduces the incidence of back splash of the chemical spun off the wafer in EBR process, thereby preventing or reducing the occurrence of defects such as the stripe pattern (or other surface oxidation) due to the wafer's contact with the chemical other than at the edge.
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