| 摘要 |
A coated semiconductor member is provided having a carbon-containing halogenated polymeric coating bonded to a surface thereof. The semiconductor member may take any of a number of forms, such as the form of a chip or a wafer containing one or more microelectronic devices. The coating may be bonded to the surface in a manner and quantity effective to provide the member an increased strength. In addition or in the alternative, the coating may improve the electrical performance of the member. Optionally, the coating has a microstructure associated with vapor phase in situ addition polymerization. Also provided is a method for coating a semiconductor member.
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