发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE, ILLUMINATION MODULE, ILLUMINATION APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT |
摘要 |
<p>A semiconductor light emitting device (10) is provided with a base substrate (12) and three LED chips (14A, 14B, and 14C) disposed on the base substrate (12). Each LED chip (14A, 14B, and 14C) includes a semiconductor multilayer structure (20) and has a rhombus shape with interior angles of approximately 60 and approximately 120 in plan view. Each semiconductor multilayer structure (20) has an HCP single crystal structure and includes a light emission layer (24). The LED chips (14A, 14B, and 14C) are arranged on the base substrate (12) so as to face one another at a vertex forming the larger interior angle in plan view. With this arrangement, the LED chips (14A, 14B, and 14C) as a whole form a substantially regular hexagonal shape.</p> |
申请公布号 |
WO2006068297(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
WO2005JP24007 |
申请日期 |
2005.12.21 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;NAGAI, HIDEO |
发明人 |
NAGAI, HIDEO |
分类号 |
H01L25/075;H01L33/06;H01L33/16;H01L33/32;H01L33/38;H01L33/50;H01L33/54;H01L33/56;H01L33/62 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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