发明名称 FLATTENING METHOD AND FLATTENING APPARATUS
摘要 <p>A flattening method can flatly process a surface of a metal film as an interconnect material over the entire film surface at a sufficiently high processing rate even when the metal film has initial surface irregularities. The flattening method for processing and flattening a surface of a metal film formed on a workpiece and having initial surface irregularities, including: coating only recessed portions of the initial surface irregularities of the metal film with a solid or pasty coating material; and processing the surface of the metal film by electrolytic processing using no abrasive.</p>
申请公布号 WO2006068283(A1) 申请公布日期 2006.06.29
申请号 WO2005JP23989 申请日期 2005.12.21
申请人 EBARA CORPORATION;TOHMA, YASUSHI;SAITOH, TAKAYUKI;SUZUKI, TSUKURU;KODERA, AKIRA;WADA, YUTAKA;KOBATA, ITSUKI 发明人 TOHMA, YASUSHI;SAITOH, TAKAYUKI;SUZUKI, TSUKURU;KODERA, AKIRA;WADA, YUTAKA;KOBATA, ITSUKI
分类号 H01L21/3205;C25F3/16;C25F7/00;H01L21/306 主分类号 H01L21/3205
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