| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board capable of improving the production efficiency of the circuit board with a surface-mounting component mounted thereon, and enhancing the mount quality of the surface mount component mounted onto the circuit board with through-holes. <P>SOLUTION: The method of manufacturing the circuit boards includes the steps of producing a first master board formed with a plurality of the circuit boards 12 each mounted with the surface mount component 11 splittably along split lines L, and including the through-holes H each having a side face electrode 12F on its inner wall face on the split lines L; producing a resin sheet 1 in a prepreg state having a surface electrode on its lower face whose area is greater than that of the through-holes H; joining the resin sheet to the first master board in a way that the surface electrode covers the through-holes H with the first master board; and splitting the first master board along the split lines L. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
