| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing (CMP) pad having a groove provided to improve polishing medium utilization, in particular, regarding a field of CMP in general. <P>SOLUTION: A polishing pad 104 has an annular polishing track 152 for polishing a wafer 120. In the wafer track 152, a plurality of grooves 112 are arranged so that they may be spaced one another both radially and circumferentially in relation to rotational nature of the pad 104 and be in at least partially non-circumferential direction in relation to the pad 104. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
