| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid state image pickup device unit, along with its manufacturing method and an imaging device equipped with the solid state image pickup device unit which realizes a smaller and thinner imaging device. <P>SOLUTION: A CCD unit (solid state image pickup device unit) 10 comprises a package 11 of thin plate in which a CCD is stored, a plate 12 provided with a through hole 12a in which the package 11 is inserted in flat state, and a PCB13 attached to the backside of package 10. The package 11 is inserted in the through hole 12a of the plate 12 in flat state while an adhesive 14 is injected and cured in a gap (d) formed between the inner wall of through hole 12a and the side surface 11c of the package 11, so that the package 11 is bonded to the plate 12. The CCD unit 10 is built in the back surface plate 9b of the lens barrel 9a of a digital camera (imaging device) 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
