发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which prevents exfoliation of insulating layers and wiring layers or occurrence of cracks and reduces a high frequency transmission loss based on a skin effect. SOLUTION: In the wiring board including the insulating layers and the wiring layers, wiring layers 2, 4, 6, 8 are constituted of metal parts and intermediate portions of the metal parts in the direction of thickness (second metal layers 2b, 4b, 6b, 8b) are constituted of porous metals of which porosity is greater than that of interfacing portions with the insulating layers. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006173399(A) 申请公布日期 2006.06.29
申请号 JP20040364772 申请日期 2004.12.16
申请人 SUMITOMO BAKELITE CO LTD;UNIV NAGOYA 发明人 HATAO TAKUYA;TAKEDA KUNIHIKO;TANAHASHI MITSURU
分类号 H05K1/09;H05K1/02;H05K3/46 主分类号 H05K1/09
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