| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate which has the high reliability of stick strength of an electrode pad and wiring pattern even if a gap in a wiring pattern becomes narrow, and to provide its manufacturing method. SOLUTION: The wiring substrate 2 includes a base material 10, a plurality of first conductive layers 12 formed on the base material 10, and a second conductive layer 14 which is formed on the base material 10 by electroless plating so as to cover the plurality of conductive layers 12 continuously. COPYRIGHT: (C)2006,JPO&NCIPI
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