| 摘要 |
PROBLEM TO BE SOLVED: To suppress power supply noise by directly mounting a bypass capacitor between pads of the power line of a BGA packaged semiconductor device. SOLUTION: BGA packaging 100 is applied to a semiconductor device 1, and the semiconductor device 1 is configured wherein a solder ball 2 is attached to a signal pad 11 for inputting and outputting signals in pads disposed on the back, and a bypass capacitor 4 comprising a solder ball terminal 41 in each of both terminals is bridged and attached between a power supply pad 12 and a ground pad 13. COPYRIGHT: (C)2006,JPO&NCIPI
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