| 摘要 |
A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12 a disposed on the first surface of the wiring substrate 11 , a semiconductor device 14 disposed on the second surface of the wiring substrate 11 and having a connection terminal 14 a connected to the flat type external connection terminal 12 a, a molding resin 15 for coating the semiconductor device 14 on the second surface of the wiring substrate 11 , a card type supporting frame 10 a having a concave portion or a hole portion fitting the wiring substrate 11 , the semiconductor device 14 , and the molding resin 15 in such a manner that the flat type external connection terminal 12 a is exposed to the first surface of the wiring substrate 11 , and adhesive resin a adhering integrally the flat type external connection terminal 12 a, the wiring substrate 11 , the semiconductor device 14 , the molding resin 15 , and the card type supporting frame 10 a. In addition, the storage apparatus 10 can be combined with a card type supporting means 21 that supports detachably with the flat type external connection terminal 12 a exposed to one of the surfaces so as to be used as a card type storage apparatus 20 having bigger size.
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