| 摘要 |
A stacked-type semiconductor device including a plurality of semiconductor elements stacked through a spacer is disclosed. The electrical characteristics with the bonding wires are improved and a narrow pitch is secured. The stacked-type semiconductor device includes a lower semiconductor element ( 2 ) fixed on a wiring board ( 1 ), an insulating spacer ( 4 ) fixed on the lower semiconductor element ( 2 ), a grounded spacer ( 10 ) fixed on the insulating spacer ( 4 ) and having a grounding conductor film formed on a part or the whole of the upper surface thereof, an upper semiconductor element ( 5 ) fixed on the grounded spacer ( 10 ), bonding wires ( 3, 6, 12 ) for electrically connecting between the lower semiconductor element ( 2 ) and the wiring board ( 1 ), between the upper semiconductor element ( 5 ) and the wiring board ( 1 ) and between the grounding conductor film of the grounded spacer ( 10 ) and the grounding terminal of the wiring board ( 1 ), respectively, and a seal resin ( 7 ) for sealing the bonding wires.
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