发明名称 Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
摘要 A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 mum on top of a support, comprising (A) a compound that generates acid on irradiation with active light or radiation, (B) a resin that displays increased alkali solubility under the action of acid, and (C) an alkali-soluble resin, wherein the component (B) comprises a resin formed from a copolymer containing a structural unit (b1) with a specific structure.
申请公布号 US2006141387(A1) 申请公布日期 2006.06.29
申请号 US20040025591 申请日期 2004.12.29
申请人 OKUI TOSHIKI;MISUMI KOICHI 发明人 OKUI TOSHIKI;MISUMI KOICHI
分类号 G03C1/76 主分类号 G03C1/76
代理机构 代理人
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