| 摘要 |
<p num="1"><br/><br/><br/>The invention relates to a contact arrangement, especially for a measuring <br/>probe or a measuring head, for measuring high frequency, especially on a <br/>semiconductor wafer. Said arrangement comprises a contact end (12) for <br/>electrically contacting planar structures. A coplanar conductor structure <br/>having at least two conductors (14) carried by a dielectric (10) is provided <br/>at the contact end (12). Between the dielectric (10) and the contact end (12), <br/>the measuring tip is configured in such a manner that the conductors (14) of <br/>the coplanar conductor structure are disposed in mid-air and in a resilient <br/>manner in relation to the dielectric (10) retaining them. The invention is <br/>characterized in that the dielectric (10) is provided with at least one <br/>arrangement (24) for transmitting electrical signals, said arrangement being <br/>electrically connected to at least one conductor (14) of the conductor <br/>structure in such a manner that the arrangement (24) transmits signals from <br/>the at least one conductor (14) that is electrically connected to the <br/>arrangement (24).<br/>
|
