| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively achieve micro-packaging capable of realizing so-called a chip size package by making the area of a package almost equal to that of a silicon chip. SOLUTION: A circuit element constituting an image sensor is formed to an image sensor forming face on the surface of a semiconductor substrate. A prescribed wiring layer formed on the circuit element in a multilayer wiring is connected to a through electrode. A transparent insulating film is formed to the upper face of the multilayer wiring. A beam from the outside can enter a light receiving element region in an image sensor forming region through the transparent insulating film. A rear-face wiring is formed to the rear face of the semiconductor substrate. A bump for external connection is formed to the external surface of the rear face. The bump is not only directly connected to the through electrode but also connected to a desired position on the rear-face wiring. COPYRIGHT: (C)2006,JPO&NCIPI
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