| 摘要 |
PROBLEM TO BE SOLVED: To surely and easily mount a semiconductor element to a heat sink by using a shrinkable tube in a heat sink mounting structure for a semiconductor element. SOLUTION: The semiconductor element 1 is fixed with a heat-shrinkable tube 3 having insulation properties by being brought into contact with the heat sink 2 having a heat radiation function. When the terminal face of the semiconductor element 1 is made as a bottom face, one face of the peripheral side faces becomes a contact pressure face to be brought into contact with the heat sink 2. A slit-like notch 2a, in which one end is opened at the end line of the heat sink 2, is formed to both sides of the fixing part 2c for the semiconductor element 1 in the heat sink 2. The heat-shrinkable tube 3 is arranged so as to surround the outer periphery of the semiconductor element 1 and the fixing part 2c of the heat sink 2 through the notch 2a, in a state of bringing the contact pressure face of the semiconductor element 1 into contact with the heat sink 2. The heat-shrinkable tube 3 is shrunk by the application of heat. Consequently, the contact face of the semiconductor element 1 can be surely fixed in a state of being brought into contact with the fixing part 2c of the heat sink 2. COPYRIGHT: (C)2006,JPO&NCIPI
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