| 摘要 |
The object of the present invention is to make it possible to pick up dies securely using a die push-up member without damaging the dies. A die push-up member 22 used for die-peeling which pushes the dies upward is disposed inside the suction holding stage 10 further toward the die feeding direction side than the die push-up member 21 used for die-pickup so that this die push-up member 22 can be move upward and downward. With the die push-up member 22 lowered, the die end portion (with respect to the die feeding direction) of the die 1 A that is picked up is moved to above the die push-up member 22 . Then, the die push-up member 22 is raised so that the die end portion (with respect to the die feeding direction) of the die 1 A is peeled from the wafer sheet 2 . Then, when the die push-up member 22 remaining in a raised state, the die 1 A is fed to the pickup center 5 , and is picked up by the collet 4 and die push-up member 21.
|
