发明名称 |
Thermal interface structure with integrated liquid cooling and methods |
摘要 |
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.
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申请公布号 |
US2006141671(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
US20060360245 |
申请日期 |
2006.02.23 |
申请人 |
HOULE SABINA J;MATAYABAS JAMES C JR |
发明人 |
HOULE SABINA J.;MATAYABAS JAMES C.JR. |
分类号 |
H01L21/50;H01L23/373 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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