发明名称 SEMICONDUCTOR SUBSTRATE COMPRISING A PN-JUNCTION AND METHOD FOR PRODUCING SAID SUBSTRATE
摘要 The invention relates to an SOI substrate comprising a support substrate, a dielectric layer and a semiconductor layer. According to the invention, a continuous pn-junction is configured in the semiconductor layer, which can be produced by the application of sub-layers that have a different doping to the SOI substrate. This permits the use of an SOI substrate in the production of semiconductor components and in particular reverse diodes.
申请公布号 WO2006066658(A2) 申请公布日期 2006.06.29
申请号 WO2005EP11992 申请日期 2005.11.09
申请人 AUSTRIAMICROSYSTEMS AG;SCHRANK, FRANZ;STOWASSER, RAINER 发明人 SCHRANK, FRANZ;STOWASSER, RAINER
分类号 H01L21/762 主分类号 H01L21/762
代理机构 代理人
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