| 摘要 |
An electronic device includes a first substrate including a first exposed conductor and a second exposed conductor. The electronic device also includes a second substrate and a conductive material that includes a first portion that contacts the first exposed conductor and a second portion that contacts the second exposed conductor. The electronic device further includes a first substrate structure that electrically insulates the first portion of the conductive material from the second portion of the conductive material. A process for forming an electronic device includes depositing a liquid adhesive over a first substrate. The process further includes contacting the liquid adhesive with a second substrate near a first edge of the second substrate. The process still further includes increasing the contact area between the liquid adhesive and second substrate as the second edge of the second substrate is moved closer to the first substrate. |
