| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus and a method for manufacturing the same, wherein a density can be increased. <P>SOLUTION: The semiconductor apparatus comprises a first semiconductor apparatus having a conductive path and a circuit element connected electrically to the conductive path, a second semiconductor apparatus having the conductive path and the circuit element connected electrically to the conductive path, and an insulating resin for sealing a gap between the first semiconductor apparatus and the second semiconductor apparatus in which one sides having the circuit element are opposed to each other at a given distance. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
