发明名称 HEATING FLOOR
摘要 PROBLEM TO BE SOLVED: To provide a heating floor which is initially very rapidly warmed and has high thermal efficiency and is free from settling or the like and has sound proof property regardless of a thickness of 18 mm or less of a whole body using a thin plate shaped body to reduce running cost. SOLUTION: The heating floor has a plate shaped body layer of 1-8 mm in thickness and a mat layer comprising a rigid foamed body in which a fluid pipe of a resin is built and has the thickness of the whole body of 18 mm or less. The rigid foamed body has a compressive yield stress of 0.5 MPa or more measured under condition of a compressive speed 10 of mm/min at a normal temperature according to JIS K 7220 and has a bending modulus of elasticity of 5-30 MPa measured under condition of 50% RH at 23°C according to JIS K 7203. The heated floor has a metal foil with a thickness of 20-400μm formed into a grooved shape in a groove in which the fluid pipe of the resin is built. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006169947(A) 申请公布日期 2006.06.29
申请号 JP20050244320 申请日期 2005.08.25
申请人 SEKISUI CHEM CO LTD 发明人 ASHIZUKA RYOSUKE;TAKEZAKI HIDEAKI;OKABE MASASHI;UNE SOICHI;HAGINO TOMOKAZU
分类号 E04F15/18;F24D3/16 主分类号 E04F15/18
代理机构 代理人
主权项
地址