| 摘要 |
PROBLEM TO BE SOLVED: To improve component mounting density in an electronic circuit member, to improve heat radiation efficiency, and to improve the degree of freedom of laying of a wiring pattern. SOLUTION: The wiring pattern is laminated and formed on the side face of a solid substrate having a plane part, and the plane part is joined with another substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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