| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin highly reliable sensor module. SOLUTION: In the constitution of the sensor module, it has a sensor chip, a protective material disposed on the active surface of the front surface of the sensor chip oppositely to the active surface via an air-gap portion, and a wiring board having the sensor chip so mounted by a flip-chip method as to insert the protective material into an opening portion. The sensor chip has electrode pads in the outside region of the active surface via a plurality of derivative wirings. Also, the protective material is disposed in the outside region of the active surface and in the inside region of the electrode pads via ribs. Further, the wiring board has a plurality of circuit terminal electrodes disposed in the peripheral edge portion of the opening portion and has conductive bumps disposed protrusively on the circuit terminal electrodes. Moreover, the conductive bumps and the electrode pads of the sensor chip are joined to each other. COPYRIGHT: (C)2006,JPO&NCIPI
|
