发明名称 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
摘要 |
A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.
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申请公布号 |
US2006138619(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
US20060353843 |
申请日期 |
2006.02.14 |
申请人 |
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发明人 |
JIANG TONGBI;KING JERROLD L. |
分类号 |
H01L23/495;H01L21/48;H05K3/34 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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