Semiconductor integrated circuit device and method of manufacturing the same

摘要

A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 mum, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder containing Pb as a main composition metal is provided at a portion outside a portion molded by the resin.