发明名称 |
Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates |
摘要 |
A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second major surface of another. At least one electrically conductive region of each sheet is partially or fully exposed. At least one electrically conductive region of a sheet is partially or fully covered, e.g., by one or more electrically conductive regions of another sheet. A method for forming such a substrate is also provided.
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申请公布号 |
US2006138640(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
US20040025401 |
申请日期 |
2004.12.29 |
申请人 |
TESSERA, INC. |
发明人 |
BEROZ MASUD;HABA BELGACEM |
分类号 |
H05K1/11;H01L21/4763;H01L23/12 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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