发明名称 Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates
摘要 A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second major surface of another. At least one electrically conductive region of each sheet is partially or fully exposed. At least one electrically conductive region of a sheet is partially or fully covered, e.g., by one or more electrically conductive regions of another sheet. A method for forming such a substrate is also provided.
申请公布号 US2006138640(A1) 申请公布日期 2006.06.29
申请号 US20040025401 申请日期 2004.12.29
申请人 TESSERA, INC. 发明人 BEROZ MASUD;HABA BELGACEM
分类号 H05K1/11;H01L21/4763;H01L23/12 主分类号 H05K1/11
代理机构 代理人
主权项
地址