发明名称 |
Packaging for electronic modules |
摘要 |
An electronic module has a non-conducting substrate having at least one opening and a die/carrier assembly mounted within the opening in the substrate. The assembly has a conducting carrier and one or more integrated circuit (IC) dies mounted to the carrier. The invention may be implemented as an electronic system comprising a circuit board (CB) and at least one such electronic module mounted to the CB.
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申请公布号 |
US2006139896(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
US20050055712 |
申请日期 |
2005.02.10 |
申请人 |
BAMBRIDGE TIMOTHY B;HERBSOMMER JUAN A;LOPEZ OSVALDO;LOTT JOEL M;SAFAR HUGO F;SHILLING THOMAS H |
发明人 |
BAMBRIDGE TIMOTHY B.;HERBSOMMER JUAN A.;LOPEZ OSVALDO;LOTT JOEL M.;SAFAR HUGO F.;SHILLING THOMAS H. |
分类号 |
H05K7/04 |
主分类号 |
H05K7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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