发明名称 |
MANUFACTURING METHOD FOR SEMICONDUCTOR CHIPS |
摘要 |
The semiconductor chip manufacturing process is carried out in processes including a protective sheet sticking process for sticking a protective sheet onto a first surface of a semiconductor wafer so that the sheet comes in contact with the TEG, a mask placing process for placing a mask on a second surface that is a surface opposite from the first surface, a plasma etching process for performing plasma etching from the second surface to remove portions corresponding to dividing regions and separate device-formation-regions into individual semiconductor chips, and a TEG removing process for removing the TEG in a state where it remains unremoved in the dividing regions and stuck to the protective sheet together with the protective sheet by peeling off the protective sheet. |
申请公布号 |
WO2006068284(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
WO2005JP23991 |
申请日期 |
2005.12.21 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;ARITA, KIYOSHI;NAKAGAWA, AKIRA |
发明人 |
ARITA, KIYOSHI;NAKAGAWA, AKIRA |
分类号 |
H01L21/78;H01L21/68;H01L23/544 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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