| 摘要 |
PROBLEM TO BE SOLVED: To provide a taping apparatus for chip components which increases the number of chip components that can be housed simultaneously in recessions on a carrier tape to improve area productivity and a speed of housing the components in the carrier tape. SOLUTION: According to the taping apparatus, a plurality of radial lines of retaining holes 3, each of which retains one chip component C, are formed on a transfer table 1 whose rotating shaft 2 is supported horizontally. A supply unit 11 supplying chip components C to the radially arranged retaining holes 3 is disposed at a supply position. The chip components C are transferred as the transfer table 1 rotates. Guide passages 41 for the chip components C are provided at an ejection position, where each guide passage 41 connects each one of the radially arranged retaining holes 3 on the transfer table 1 to each one of recessions 51 on a carrier tape 50. This allows the chip components C to be transferred simultaneously from the radially arranged retaining holes 3 into the recessions 51 on the carrier tape 50. COPYRIGHT: (C)2006,JPO&NCIPI
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