| 发明名称 |
Wafer planarization composition and method of use |
| 摘要 |
A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.
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| 申请公布号 |
US2006141913(A1) |
申请公布日期 |
2006.06.29 |
| 申请号 |
US20050287941 |
申请日期 |
2005.11.28 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
RUEB CHRISTOPHER J.;WEBB RICHARD J.;VELAMAKANNI BHASKAR V. |
| 分类号 |
B24B29/00 |
主分类号 |
B24B29/00 |
| 代理机构 |
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代理人 |
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