发明名称 |
POLISHING COMPOSITION AND POLISHING METHOD |
摘要 |
The present invention provide a chemical-mechanical polishing composition for inhibiting dishing and erosion as well as rapidly polishing an insulating film and barrier film at the same time while maintaining the flatness of the substrate surface polished. The present chemical-mechanical polishing composition comprises methanesulfonic acid, an alkali metal ion, an oxidizing agent, a silica abrasive and water, and has a pH of 8 to 12. - 1 - |
申请公布号 |
WO2006068328(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
WO2005JP24190 |
申请日期 |
2005.12.22 |
申请人 |
SHOWA DENKO K.K.;NISHIOKA, AYAKO;ITOH, YUJI;SHIMAZU, YOSHITOMO |
发明人 |
NISHIOKA, AYAKO;ITOH, YUJI;SHIMAZU, YOSHITOMO |
分类号 |
C09G1/02;B24B37/00;C09K3/14;H01L21/304;H01L21/306 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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