发明名称 POLISHING COMPOSITION AND POLISHING METHOD
摘要 The present invention provide a chemical-mechanical polishing composition for inhibiting dishing and erosion as well as rapidly polishing an insulating film and barrier film at the same time while maintaining the flatness of the substrate surface polished. The present chemical-mechanical polishing composition comprises methanesulfonic acid, an alkali metal ion, an oxidizing agent, a silica abrasive and water, and has a pH of 8 to 12. - 1 -
申请公布号 WO2006068328(A1) 申请公布日期 2006.06.29
申请号 WO2005JP24190 申请日期 2005.12.22
申请人 SHOWA DENKO K.K.;NISHIOKA, AYAKO;ITOH, YUJI;SHIMAZU, YOSHITOMO 发明人 NISHIOKA, AYAKO;ITOH, YUJI;SHIMAZU, YOSHITOMO
分类号 C09G1/02;B24B37/00;C09K3/14;H01L21/304;H01L21/306 主分类号 C09G1/02
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