ELECTRIPLAST MOLDABLE CAPSULE AND METHOD OF MANUFACTURE

摘要

A method to form moldable capsules of a conductively doped resin-based material are created. The method comprises compressing a bundle of micron conductive fiber strands by passing the bundle through a compressing ring. A resin-based material is extruded/pultruded onto the compressed bundle. The resin-based material and the bundle are sectioned into moldable capsules. The micron conductive fiber comprises between about 20 % and about 50 % of the total weight of each moldable capsule.