| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ball grid array substrate provided with a window in which a window is formed in a core material without using a core material of a thin plate, and a semiconductor chip is built in the window to reduce the thickness of a package, and to provide a manufacturing method for it. <P>SOLUTION: This substrate comprises a first outer layer which comprises a circuit pattern and a wire bonding pad pattern, and has the window suitable for the size of a chip to be mounted, and in which the chip is connected to the wire bonding pad by wire bonding, a second outer layer which has a circuit pattern, the part corresponding to a window region of the first outer layer and a solder ball pad pattern, and in which the chip is mounted on the ball pad, and an insulating layer formed between the first outer layer and the second outer layer in which a window is formed at the part corresponding to the window of the first outer layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
