| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which makes it possible to manufacture a reliable semiconductor device easily, and to provide the reliable semiconductor device and its manufacturing method. <P>SOLUTION: The wiring board comprises a base substrate 10, a wiring pattern 20 formed on the base substrate 10, and a resin layer 30 which partially covers the wiring pattern 20. The resin layer 30 contains two or more separated portions 32 in corner areas 44 which are within the smallest rectangle 40 surrounding the resin layer 30 and are outside a circle or ellipse which touches the rectangle 40 internally. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
