| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress bending deformation of a chip body due to volumetric shrinkage of an adhesive. <P>SOLUTION: The adhesive comprises a resin mixture M consisting of a main component which develops adhesive strength by curing and a curing agent for promoting the curing of the main component, and a filler F. The filler F is composed of particles having a maximum particle size of 0.8 μm or less. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
