发明名称 METHOD AND APPARATUS FOR POSITIONING AND HOLDING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate positioning and holding method constituted so as to accurately and easily position a substrate which has a sheet structure and reaches a considerable weight according to circumferences, on a stage by slight force to hold it on the stage in a positioned state, and a substrate positioning and holding device. SOLUTION: The substrate B fed to the surface of the stage 1 turns float by the jet air from the air opening 5 formed to the stay 4 provided in connection with the stage 1. In this state, the substrate B is positioned at a predetermined position by bringing the locking piece 13 of a control element 10 into contact with the substrate B from a lateral direction by a slight lateral force. The ejection of air is stopped in the contact state due to the control element 10 and the substrate B is held on the stage 1 by the pressing of the substrate B to the stage 1 due to the locking piece 13 and the suction of the substrate B from the air opening 5. Even if the detection standard of a sensor is relaxed, the frequent occurrence of an alarm can be avoided. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006170733(A) 申请公布日期 2006.06.29
申请号 JP20040362156 申请日期 2004.12.15
申请人 SHARP CORP 发明人 SAITO TAKATOSHI
分类号 G01N21/84;G01M11/00;G02F1/13;H01L21/68 主分类号 G01N21/84
代理机构 代理人
主权项
地址