发明名称 |
Method of manufacturing alloy sputtering targets |
摘要 |
The present invention relates to a composite sputtering target comprising a plurality of bonded metal pieces. The composite sputtering target further comprises a bonded region between the metal pieces. The bonded region may comprise an inter-metallic region upon bonding. The composite sputter target of the present invention may be used in conjunction with an apparatus for sputtering alloy films on substrates.
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申请公布号 |
US2006137969(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
US20040026644 |
申请日期 |
2004.12.29 |
申请人 |
FELDEWERTH GERALD B;BARNAK JOHN P;GOLDSTEIN MICHAEL |
发明人 |
FELDEWERTH GERALD B.;BARNAK JOHN P.;GOLDSTEIN MICHAEL |
分类号 |
C23C14/00 |
主分类号 |
C23C14/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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