发明名称 Method of manufacturing alloy sputtering targets
摘要 The present invention relates to a composite sputtering target comprising a plurality of bonded metal pieces. The composite sputtering target further comprises a bonded region between the metal pieces. The bonded region may comprise an inter-metallic region upon bonding. The composite sputter target of the present invention may be used in conjunction with an apparatus for sputtering alloy films on substrates.
申请公布号 US2006137969(A1) 申请公布日期 2006.06.29
申请号 US20040026644 申请日期 2004.12.29
申请人 FELDEWERTH GERALD B;BARNAK JOHN P;GOLDSTEIN MICHAEL 发明人 FELDEWERTH GERALD B.;BARNAK JOHN P.;GOLDSTEIN MICHAEL
分类号 C23C14/00 主分类号 C23C14/00
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