| 摘要 |
An apparatus and a method for cleaning a wafer are described. A wafer is inserted into a bath by a loader, is supported by a guide in the bath, and is rotated by a roller. A cleaning solution such as dilute HF may remove impurities from the wafer by an etching operation, and then DI water is used to rinse the wafer. Since the wafer rotates by the roller, etching may be relatively uniform. Moreover, the rotation of the wafer during the rinse step can prevent or reduce the incidence of impurities combining with silicon dangling bonds on the wafer. Therefore, the apparatus and the method of the invention can effectively reduce or prevent defects on the wafer, regardless of loading configuration of the wafers.
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