PLATING SOLUTION, METHOD FOR PREPARING PLATING SOLUTION, SURFACE TREATMENT METHOD AND CONTACT MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a plating solution which can provide a contact member having low contact resistance balanced with the capability of preventing the deposition of a foreign matter, for instance, when used for surface-treating a contacting part of a contact member for electrically connecting one device to another device; a method suitable for preparing the plating solution; a surface treatment method for imparting the low contact resistance and the capability of preventing the deposition of the foreign matter onto the surface of an article to be plated through using the plating solution; and the contact member having the low contact resistance balanced with the capability of preventing the deposition of the foreign matter. SOLUTION: The plating solution includes a metal source and carbon particles with an average particle diameter of 1μm or smaller. The preparation method is suitable for preparing the plating solution. The surface treatment method uses the plating solution. The contact member (A) has a terminal portion which contacts with an electrode of an analyte, is directed at bringing the terminal portion into contact with the electrode of the analyte to confirm the electrical conduction when testing electrical characteristics of the analyte, and is provided with a particle-containing metallic film 4 including carbon particles 3 in the terminal portion of a substrate 1 composing the contact member (A). COPYRIGHT: (C)2006,JPO&NCIPI