Stack chip package

摘要

An improved stack chip package comprising a lead frame, chip, plural leads and coating, among which: the lead frame is made of metal materials through impact extrusion forming two or four lines of rectangular plural pins comprising three lead segments making the pin -shaped; So install a chip on the first segment's inside surface, bond wires at the chip's bond pads and each segment will form an electrical connection, coat the part where the lead is jointed for the completion of sealing operation, i.e. the chip's upper and lower sides can be connected to another chip package by the contact of the first and second segments, and the chip package can be stacked freely besides reduced volume and strengthened data processing performance.